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New Artificial Ionic Skin Developed for Long Service Electronic Life With the Ability to Self-Heal

An engineered ionic skin was developed, imitating the human skin with a ‘repairable structure’ based on nanofibers. Read to know more about it.

New Artificial Ionic Skin Developed for Long Service Electronic Life With the Ability to Self-Heal
3D Printing Metal Market Analysis, Revenue Growth, Demand Future Forecast 2027

3D Printing Metal Market growing demand for 3D printing metal from the aerospace & defense sector is one of the significant factors influencing the growth.

3D Printing Metal Market Analysis, Revenue Growth, Demand Future Forecast 2027
Lightwave Logic Announces Publication of U.S. Patent Application for Breakthrough Chip-Scale Packaging Technique to Enable Foundry-Level Packaging of Polymer Modulators

Ability to Fabricate Polymer Modulators Using Chip-Scale Techniques Aligns the Lightwave Technology Platform with Mainstream Silicon Electronics Chip-Scale Packaging, Enabling Simplified High…

Lightwave Logic Announces Publication of U.S. Patent Application for Breakthrough Chip-Scale Packaging Technique to Enable Foundry-Level Packaging of Polymer Modulators
Posts Grid
New Artificial Ionic Skin Developed for Long Service Electronic Life With the Ability to Self-Heal

An engineered ionic skin was developed, imitating the human skin with a ‘repairable structure’ based on nanofibers. Read to know more about it.

New Artificial Ionic Skin Developed for Long Service Electronic Life With the Ability to Self-Heal
3D Printing Metal Market Analysis, Revenue Growth, Demand Future Forecast 2027

3D Printing Metal Market growing demand for 3D printing metal from the aerospace & defense sector is one of the significant factors influencing the growth.

3D Printing Metal Market Analysis, Revenue Growth, Demand Future Forecast 2027
Lightwave Logic Announces Publication of U.S. Patent Application for Breakthrough Chip-Scale Packaging Technique to Enable Foundry-Level Packaging of Polymer Modulators

Ability to Fabricate Polymer Modulators Using Chip-Scale Techniques Aligns the Lightwave Technology Platform with Mainstream Silicon Electronics Chip-Scale Packaging, Enabling Simplified High…

Lightwave Logic Announces Publication of U.S. Patent Application for Breakthrough Chip-Scale Packaging Technique to Enable Foundry-Level Packaging of Polymer Modulators
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