Lightwave Logic Announces Publication of U.S. Patent Application for Breakthrough Chip-Scale Packaging Technique to Enable Foundry-Level Packaging of Polymer Modulators

Ability to Fabricate Polymer Modulators Using Chip-Scale Techniques Aligns the Lightwave Technology Platform with Mainstream Silicon Electronics Chip-Scale Packaging, Enabling Simplified High-Volume Manufacturing through Foundry-Level Packaging    
ENGLEWOOD, Colo. , June 23, 2022 /PRNewswire/ — Lightwave Logic, Inc. (NASDAQ: LWLG), a technology platform company leveraging its proprietary electro-optic polymers to transmit data at higher speeds with less power, today announced the publication of a U.

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